EP 2971263 A1 20160120 - ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES
Title (en)
ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES
Title (de)
ELEKTROLYTISCHE ABSCHEIDUNG VON SILBER MIT FLUORPOLYMERNANOPARTIKELN
Title (fr)
DÉPÔT ÉLECTROLYTIQUE D'ARGENT COMPRENANT DES NANOPARTICULES DE POLYMÈRE FLUORÉ
Publication
Application
Priority
- US 201361789936 P 20130315
- US 2014028479 W 20140314
Abstract (en)
[origin: WO2014144180A1] Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.
IPC 8 full level
C25D 3/46 (2006.01); C25D 3/64 (2006.01); C25D 7/00 (2006.01); C25D 15/00 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP US)
C25D 3/46 (2013.01 - EP US); C25D 3/64 (2013.01 - EP US); C25D 7/00 (2013.01 - EP US); C25D 15/00 (2013.01 - EP US); H01R 13/03 (2013.01 - EP US)
Citation (search report)
See references of WO 2014144180A1
Citation (examination)
US 2012067733 A1 20120322 - ZHANG-BEGLINGER WAN [CH], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2014144180 A1 20140918; CN 105229204 A 20160106; EP 2971263 A1 20160120; HK 1219987 A1 20170421; KR 20150131346 A 20151124; US 2016032479 A1 20160204
DOCDB simple family (application)
US 2014028479 W 20140314; CN 201480026664 A 20140314; EP 14721119 A 20140314; HK 16107911 A 20160706; KR 20157029844 A 20140314; US 201414776879 A 20140314