EP 3325264 A1 20180530 - SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING SUCH A SUBSTRATE
Title (en)
SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING SUCH A SUBSTRATE
Title (de)
SUBSTRAT FÜR ELEKTRISCHE SCHALTKREISE UND VERFAHREN ZUR HERSTELLUNG EINES DERARTIGEN SUBSTRATES
Title (fr)
SUBSTRAT DESTINÉ À UN CIRCUIT ÉLECTRIQUE ET PROCÉDÉ DE FABRICATION DUDIT SUBSTRAT
Publication
Application
Priority
- DE 102015111667 A 20150717
- EP 2016067074 W 20160718
Abstract (en)
[origin: WO2017013075A1] The invention relates to a substrate (1, 10) for electrical circuits, comprising at least one metal layer (2, 3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2, 3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a', 6a'', 6b', 6b'') to the metal layer (2, 3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a', 6a'', 6b', 6b'').
IPC 8 full level
B32B 5/12 (2006.01); B32B 5/20 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 9/06 (2006.01); B32B 29/08 (2006.01)
CPC (source: EP KR US)
B32B 3/266 (2013.01 - KR); B32B 5/12 (2013.01 - EP US); B32B 5/20 (2013.01 - EP US); B32B 7/12 (2013.01 - EP KR US); B32B 9/005 (2013.01 - EP US); B32B 9/041 (2013.01 - EP KR US); B32B 9/06 (2013.01 - EP US); B32B 15/017 (2013.01 - KR); B32B 15/043 (2013.01 - EP US); B32B 15/12 (2013.01 - EP KR US); B32B 15/20 (2013.01 - EP KR US); B32B 29/002 (2013.01 - EP US); B32B 29/08 (2013.01 - EP US); C09J 133/00 (2013.01 - KR); C09J 163/00 (2013.01 - KR); C09J 175/04 (2013.01 - KR); C25D 11/005 (2013.01 - EP US); C25D 11/04 (2013.01 - EP US); C25D 17/12 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP KR US); H05K 1/0201 (2013.01 - US); H05K 1/0313 (2013.01 - US); H05K 1/053 (2013.01 - EP KR US); H05K 3/4688 (2013.01 - US); B32B 2255/06 (2013.01 - EP US); B32B 2255/205 (2013.01 - EP US); B32B 2255/26 (2013.01 - EP US); B32B 2255/28 (2013.01 - EP US); B32B 2264/107 (2013.01 - EP US); B32B 2307/202 (2013.01 - EP US); B32B 2307/206 (2013.01 - EP US); B32B 2307/54 (2013.01 - EP US); B32B 2457/08 (2013.01 - EP KR US); B32B 2605/00 (2013.01 - EP US); C25D 11/08 (2013.01 - EP US); H05K 2201/0116 (2013.01 - EP KR US); H05K 2201/0338 (2013.01 - EP US); H05K 2203/0315 (2013.01 - EP KR US); H05K 2203/11 (2013.01 - US); H05K 2203/1126 (2013.01 - EP KR US)
Citation (search report)
See references of WO 2017013075A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015111667 A1 20170119; CN 107848245 A 20180327; CN 107848246 A 20180327; EP 3325264 A1 20180530; EP 3325265 A1 20180530; JP 2018523593 A 20180823; JP 2018533197 A 20181108; JP 6803369 B2 20201223; JP 6894425 B2 20210630; KR 102295797 B1 20210831; KR 102311944 B1 20211013; KR 20180030150 A 20180321; KR 20180030151 A 20180321; US 10821704 B2 20201103; US 10940671 B2 20210309; US 2018200989 A1 20180719; US 2018200990 A1 20180719; WO 2017013073 A1 20170126; WO 2017013075 A1 20170126
DOCDB simple family (application)
DE 102015111667 A 20150717; CN 201680041496 A 20160718; CN 201680041497 A 20160718; EP 16741600 A 20160718; EP 16745646 A 20160718; EP 2016067069 W 20160718; EP 2016067074 W 20160718; JP 2018500918 A 20160718; JP 2018500927 A 20160718; KR 20187004430 A 20160718; KR 20187004432 A 20160718; US 201615744349 A 20160718; US 201615744363 A 20160718