EP 3552235 A1 20191016 - PARALLELISABLE METHOD FOR INTEGRATING POWER CHIPS AND POWER ELECTRONICS MODULES
Title (en)
PARALLELISABLE METHOD FOR INTEGRATING POWER CHIPS AND POWER ELECTRONICS MODULES
Title (de)
PARALLELISIERBARES VERFAHREN ZUR INTEGRATION VON LEISTUNGSCHIPS UND LEISTUNGSELEKTRONIKMODULEN
Title (fr)
PROCEDE D'INTEGRATION DE PUCES DE PUISSANCE PARALLELISABLE ET MODULES ELECTRONIQUES DE PUISSANCE
Publication
Application
Priority
- FR 1662335 A 20161212
- FR 2017053392 W 20171205
Abstract (en)
[origin: WO2018109315A1] The method comprises the steps of 1) producing first and second blanks (EB1) including reserved-space defining means (HM1, HM2), by laminating insulating and conductive inner layers (PP, CP) on copper plates forming a base (MB1), at least one electronic chip being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.
IPC 8 full level
H01L 25/11 (2006.01); H01L 23/473 (2006.01); H01L 23/538 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01)
CPC (source: EP US)
H01L 23/3114 (2013.01 - US); H01L 23/473 (2013.01 - EP); H01L 23/49838 (2013.01 - US); H01L 23/5385 (2013.01 - EP US); H01L 23/5389 (2013.01 - US); H01L 25/117 (2013.01 - EP US); H01L 25/18 (2013.01 - US); H03K 17/60 (2013.01 - US); H01L 25/18 (2013.01 - EP); H05K 1/056 (2013.01 - EP); H05K 2201/10166 (2013.01 - EP)
Citation (search report)
See references of WO 2018109315A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
FR 3060255 A1 20180615; FR 3060255 B1 20190719; CN 110291633 A 20190927; CN 110291633 B 20230530; EP 3552235 A1 20191016; JP 2020501381 A 20200116; US 10734368 B2 20200804; US 2020185365 A1 20200611; WO 2018109315 A1 20180621
DOCDB simple family (application)
FR 1662335 A 20161212; CN 201780086323 A 20171205; EP 17822726 A 20171205; FR 2017053392 W 20171205; JP 2019551752 A 20171205; US 201716468448 A 20171205