EP 3584335 A4 20200819 - Ni-BASED HEAT-RESISTANT ALLOY AND METHOD FOR MANUFACTURING SAME
Title (en)
Ni-BASED HEAT-RESISTANT ALLOY AND METHOD FOR MANUFACTURING SAME
Title (de)
NI-BASIERTE WÄRMEBESTÄNDIGE LEGIERUNG UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
ALLIAGE RÉSISTANT À LA CHALEUR À BASE DE Ni ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- JP 2017026457 A 20170215
- JP 2018005298 W 20180215
Abstract (en)
[origin: EP3584335A1] A Ni-based heat resistant alloy of the present invention contains predetermined amounts of C, Si, Mn, P, S, N, O, Ni, Co, Cr, Mo, W, B, Al, Ti, Nb, REM, Mg, Ca, and the balance of Fe and impurities, wherein [0.1≤Mo+W≤12.0], [1.0≤4×Al+2×Ti+Nb≤12.0], and [P+0.2×Cr×B<0.035] are satisfied, a shortest distance from a center portion to an outer surface portion of a cross section of an alloy member is 40 mm or more, the cross section being perpendicular to a longitudinal direction of the alloy member, an austenite grain size number at the outer surface portion is -2.0 to 4.0, a total content of Al, Ti and Nb which are present as precipitates obtained by extraction residue analysis satisfies [(Al+Ti+Nb)<sub>PB</sub>/(Al+Ti+Nb)<sub>PS</sub>≤10.0], and [YS<sub>S</sub>/YS<sub>B</sub>≤1.5] and [TS<sub>S</sub>/TS<sub>B</sub>≤1.2] are satisfied at a normal temperature.
IPC 8 full level
C22C 19/05 (2006.01); C22C 30/00 (2006.01); C22F 1/10 (2006.01)
CPC (source: EP KR US)
C22C 19/051 (2013.01 - US); C22C 19/055 (2013.01 - EP KR); C22C 30/00 (2013.01 - EP); C22F 1/10 (2013.01 - EP KR US)
Citation (search report)
- [XI] EP 2743362 A1 20140618 - NIPPON STEEL & SUMITOMO METAL CORP [JP]
- [A] EP 2479300 A1 20120725 - SUMITOMO METAL IND [JP]
- [A] JP 2004003000 A 20040108 - SUMITOMO METAL IND
- [A] JP 2013095949 A 20130520 - NIPPON STEEL & SUMITOMO METAL CORP
- See references of WO 2018151222A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3584335 A1 20191225; EP 3584335 A4 20200819; CA 3053741 A1 20180823; CN 110291216 A 20190927; JP 6819700 B2 20210127; JP WO2018151222 A1 20191121; KR 20190117605 A 20191016; US 2020010931 A1 20200109; WO 2018151222 A1 20180823
DOCDB simple family (application)
EP 18753655 A 20180215; CA 3053741 A 20180215; CN 201880011398 A 20180215; JP 2018005298 W 20180215; JP 2018568607 A 20180215; KR 20197026436 A 20180215; US 201816483850 A 20180215