Global Patent Index - EP 4199835 A1

EP 4199835 A1 20230628 - METHOD FOR PRODUCING A SURGICAL INSTRUMENT FOR GRASPING AND/OR HOLDING AND/OR GUIDING A NEEDLE

Title (en)

METHOD FOR PRODUCING A SURGICAL INSTRUMENT FOR GRASPING AND/OR HOLDING AND/OR GUIDING A NEEDLE

Title (de)

VERFAHREN ZUM HERSTELLEN EINES CHIRURGISCHEN INSTRUMENTS ZUM FASSEN UND/ODER HALTEN UND/ODER FÜHREN EINER NADEL

Title (fr)

PROCÉDÉ DE PRODUCTION D'UN INSTRUMENT CHIRURGICAL POUR SAISIR ET/OU MAINTENIR ET/OU GUIDER UNE AIGUILLE

Publication

EP 4199835 A1 20230628 (DE)

Application

EP 21765903 A 20210819

Priority

  • DE 102020210664 A 20200821
  • EP 2021073062 W 20210819

Abstract (en)

[origin: WO2022038234A1] The invention relates to a method for producing a surgical instrument for grasping and/or holding and/or guiding a needle, comprising the following steps: a) providing a first arm part (10) and a second arm part (10'), wherein the first arm part (10) and the second arm part (10') each comprise a distal holding jaw (30, 30') having a recess and a solder deposit region in a free end of the distal holding jaw (30, 30'); b) inserting a hard metal insert (40) into the recess in the distal holding jaw (30) of the first arm part (10) and inserting a hard metal insert (40') into the recess in the distal holding jaw (30') of the second arm part (10'); c) joining the first arm part (10) and the second arm part (10'), wherein, when joined, the first arm part (10) and the second arm part (10') are mounted so as to be pivotable relative to one another at a joint (20); d) filling the solder deposit region of the first arm part (10) and filling the solder deposit region of the second arm part (10') with solder in each case; and e) soldering the hard metal insert (40) inserted into the recess in the distal holding jaw (30) of the first arm part (10) to the first arm part (10) and soldering the hard metal insert (40') inserted into the recess in the distal holding jaw (30') of the second arm part (10') to the second arm part (10'), in each case using the solder.

IPC 8 full level

A61B 17/06 (2006.01)

CPC (source: EP US)

A61B 17/062 (2013.01 - EP US); B23K 1/0008 (2013.01 - US); B23K 1/20 (2013.01 - US); B23K 35/3033 (2013.01 - US); A61B 2017/00526 (2013.01 - EP US)

Citation (search report)

See references of WO 2022038234A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

DE 102020210664 A1 20220224; CN 116056647 A 20230502; EP 4199835 A1 20230628; JP 2023540203 A 20230922; US 2024024974 A1 20240125; WO 2022038234 A1 20220224

DOCDB simple family (application)

DE 102020210664 A 20200821; CN 202180051277 A 20210819; EP 2021073062 W 20210819; EP 21765903 A 20210819; JP 2023512447 A 20210819; US 202118021767 A 20210819